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1.Solderability Test
Test Objective:
To verify the solderability of component leads and solder pads.
To Ensure:
Stable solder strength
Reliable SMT/PCB assembly
Consistent mass production performance
2.Resistance to Soldering Heat
Test Objective:
To verify the device’s ability to withstand thermal shock during the soldering process.
3.Bending Strength Test
Test Objective:
To verify the mechanical strength of the pins and ensure structural reliability during transportation, installation, and use.
