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1.High Temperature Reverse Bias Test
Test Objective:
To simulate the operating state of a device under long-term reverse voltage at high temperatures, verifying the reliability of the chip junction, electrode structure, and package.
Verification Content:
Reverse leakage current stability;
Breakdown voltage reliability;
Chip defects and potential failure risks.
Application Value:
To ensure the stability of the rectifier diode in long-term operating environments such as high-voltage power supplies and industrial equipment.
2.High Humidity High Temperature Reverse Bias Test
Test Objective:
To simulate the reliability of devices under reverse bias conditions in high temperature, high humidity, and high pressure environments.
Verification Content:
Effects of moisture on packaging materials;
Leakage current variation;
Insulation reliability.
Application Value:
Suitable for applications with high environmental adaptability requirements, such as outdoor equipment, new energy equipment, and industrial power supplies.
3.Forward Surge Test
Test Objective:
To verify the rectifier’s ability to withstand transient high current surges.
Verification Content:
Surge current capability;
Chip thermal shock capability;
PN junction reliability.
Application Value:
To ensure reliable operation of the product under power-on transients, power grid fluctuations, and abnormal load conditions.
