Skip to content 
Quality Manufacturing
R&D AND QUALITY CONTROL
Quality is not determined by testing, but testing is the only criterion for verifying quality. POWERSi leverages the vertical integration capability of the entire industry chain, and independently controls the entire process from chip design, wafer manufacturing to packaging and testing, ensuring that every shipped rectifier diode can withstand the harsh tests of high frequency, high temperature, and high humidity.
Patents and Technical Achievements
To date, 17 utility model patents have been granted, with another 10 currently under review; independent intellectual property rights have been established in the field of power semiconductor packaging and testing.
Our Advantages
INTEGRATED MANUFACTURING
RELIABLE QUALITY
ENGINEERING & TECHNICAL SUPPORT
Supply Chain & One-Stop Support
Supply Chain Details
Prepare for Stable Procurement and Continuous Delivery
POWERSi coordinates key materials, packaging and manufacturing, process testing, and finished-product delivery within a controlled supply chain. Our production flow covers chip and lead-frame confirmation, die attach, wire bonding, welding, cleaning, molding, curing, trim and form, electrical testing, and packaging. ERP and MES platforms support order, production, and batch-information management.
Based on the product and application, we assist customers with part confirmation, sample evaluation, reliability validation, and mass-production introduction. Clear technical requirements, controlled manufacturing processes, and responsive project communication help reduce sourcing risk and improve product-introduction efficiency.
One-Stop Semiconductor Support
POWERSi provides more than power semiconductor devices. We support customers throughout the sourcing and product-introduction process. Customers can submit a target part number, BOM, or actual operating conditions, and our team can assist with part selection based on voltage, current, switching frequency, temperature, package, and thermal requirements.
Our service covers requirement review, part selection and replacement evaluation, sample support, technical documentation, reliability validation, mass-production coordination, and after-sales technical assistance. This gives customers a more connected sourcing experience across bridge rectifiers, recovery rectifiers, Schottky devices, and SiC products.
Capabilities & Services
Manufacturing & Quality
OEM/ODM Customization Services
● Flexible Customization of Chip/Device Parameters
Not limited to standard products, we can customize and develop core parameters such as voltage, current, forward voltage drop (VF), and reverse recovery time (Trr) based on the actual application scenarios of our customers.
● Brand Deep Customization
Support laser marking service, which can mark permanent information such as logo, model, production cycle, etc. according to customer needs. At the same time, we provide logo customization and complete packaging customization to assist customers in brand building.
● Datasheet Customization Service
Provide exclusive versions of datasheet for brand customers, unify technical document style and brand identity, and facilitate end market promotion.
● Diversified Packaging Solutions
Fully supports packaging forms such as reels, tubes, trays, etc., adapts to automated surface mount production lines, and reduces line changing time.
● Quick Sample Service
Conventional samples can be delivered within 3-5 working days, and professional engineers can provide one-on-one technical selection support to quickly verify the feasibility of the solution.
● Full Cycle Project Support
From the project evaluation stage onwards, dedicated engineers will be responsible for technical selection and testing verification. After entering mass production, we will provide clear MOQ (minimum order quantity), stable production capacity guarantee, and strict delivery management.
Power Device Packaging and Development Capability
Based on years of accumulation in packaging technology, we have the full process capability from packaging design, mold development to mass production, which can flexibly meet the needs of different power levels and application scenarios.
● Mainstream Packaging Platforms are Fully Covered
TO-220/TO-220F: Suitable for medium power applications with full plastic packaging and heat sink packaging, meeting the requirements of general rectification and fast recovery scenarios.
TO-247/TO-247-4L: Standard package for high-power discrete devices, supporting the addition of Kelvin source pins to reduce switching losses, and is the preferred solution for SiC Schottky diodes.
TO-252 (DPAK): Compact surface mount packaging suitable for automated surface mount production with medium power density requirements.
TO-263 (D ² PAK): High current surface mount package, which can replace TO-220 for surface mount design and improve production efficiency.
● Key Process Capability
Multi Chip Combination: supports multiple internal connection structures such as common cathode and series connection within TO-247 and other packages.
Advanced Interconnection: Mastering thick aluminum wire/strip bonding and copper clip technology, effectively reducing on resistance and parasitic inductance.
High Temperature Tolerance: High Tg plastic encapsulation material is used to ensure the long-term reliability of the device at a junction temperature of 175 ° C.
● Reliability Verification
Each new packaged product must undergo rigorous AEC-Q101 or JEDEC standard testing, including temperature cycling (TCT), high-pressure cooking (PCT), high temperature reverse bias (HTRB), etc., to ensure stable performance of the product under various extreme working conditions.
Quality Control Process
● Incoming Quality Control (IQC) ：We implement rigorous source controls, conducting full-batch inspections of appearance, dimensions, and electrical properties for critical raw materials—such as wafers, lead frames, and molding compounds—to ensure strict adherence to design specifications.
● In-Process Quality Control (IPQC) ：Quality control points are established at critical stages—including die bonding, wire bonding, and molding—utilizing SPC (Statistical Process Control) to monitor process parameters in real-time and ensure process stability and control.
● Final Quality Control (FQC) ：We conduct 100% electrical performance testing—covering High-Temperature Reverse Bias (HTRB), surge current, and avalanche ruggedness—complemented by automated visual inspection to eliminate any defective products.
● Outgoing Quality Control (OQC) ：Shipments undergo strict sampling inspections based on AQL standards, covering electrical properties, dimensions, solderability, and packaging integrity; a certificate of conformity is issued only after final verification.
● International Quality Standards ：The company is ISO9001 certified; our products fully comply with environmental regulations such as RoHS and REACH, and halogen-free options are available. We are committed to a “zero-defect” quality culture, delivering highly reliable power devices to our customers.
Application Technical Support and Services
Our application team goes beyond simply providing products; we are dedicated to helping customers solve technical challenges throughout the entire lifecycle, from product selection to mass production.
● Deep Application Circuit Design Support
MPPT Boost and Inverter Circuits: Provides optimization suggestions for freewheeling diodes and RCD snubber circuit parameters of the output rectifier bridge to suppress voltage spikes.
High-Frequency Drive Circuit Optimization: Assists customers in designing gate drive protection circuits for SiC MOSFETs/SiC SBDs to minimize oscillations.
Temperature Design Guidance: Based on thermal simulation results, provides actionable suggestions on PCB copper area, via layout, and heatsink selection.
● Precise Selection Support
Based on the customer’s actual operating conditions—such as switching frequency, bus voltage, ambient temperature, and cooling method—our FAE team recommends the most cost-effective and performance-balanced combination of devices, covering the full range of rectifiers from silicon-based FREDs to wide-bandgap SiC.
● System-Level Failure Analysis Support
When clients encounter application problems, we provide failure analysis services led by senior engineers. The process includes:
1. Electrical Verification: Precisely locating the abnormal IV characteristics of the failed pin using a characterization instrument.
2. Non-Destructive Testing: Inspecting internal bonding wires and solder for voids or breaks using X-rays.
3. Physical Dissection: Identifying overvoltage, overcurrent, or process defects through chip delamination and SEM scanning.
4. Root Cause Report: Providing a detailed analysis report including the root cause and improvement recommendations.
