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Standard Bridge Rectifier GBU2510 - 25A, 1000V from China Suppliers and Factory - Minimum Order 250Pcs

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IF25A
VRRM (Min)1000V
VF (Typ) @125℃0.88V
IR (Typ) @125℃30uA
TJ-55℃~+150℃
Minimum order quantity250Pcs
Delivery time4-6 weeks
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    GBU2510 is the ideal choice for you to achieve efficient full-bridge rectification! It features enhanced GPP process performance.

    High Reliability

    The glass passivation layer formed by the GPP process is closely bonded to the chip, reducing failures from mechanical stress, thermal shock, or packaging leakage.

    High-Temperature Performance

    With a glass melting point reaching above 500℃, the device operates stably for extended periods within the temperature range of -55℃ to +150℃.

    Low Leakage Current

    The glass layer effectively prevents ion migration, minimizes leakage current, and significantly improves electrical performance consistency.

    Stable Structure & Lifespan

    Featuring a uniform, dense passivation layer without air gaps, it has excellent wetting with the substrate, increasing the device lifespan by tens of times.

    GBU2510 Versatile Applications

    Suitable for demanding environments and widely applied across industrial and consumer electronics fields requiring high reliability:

    Automotive Electronics Industrial Power Supplies Switching Power Supplies LED Lighting Audio Power Supplies Displays Televisions Printers Adapters High-power Chargers Induction Cookers Dishwashers Audio Equipment Household Appliances

    FEATURES

    • Glass passivated chip
    • High surge current capability
    • Low leakage current
    • Compliant to RoHS directive 2011/65/EU
    • Solder dip 275 °C max. 7 s

    Mechanical Data

    • Molding compound meets UL 94 V-0 flammability rating, RoHS-compliant
    • Terminals: Tin plated leads, solderable per J-STD002 and JESD22-B102
    • Polarity: As marked on body
    • Weight: Approximate 3.8g/3.5g (short pin)

    Frequently Asked Questions

    What are the main benefits of the GPP process in GBU2510?
    The GPP (Glass Passivated Process) forms a glass passivation layer closely bonded to the chip. This structure makes the device less likely to fail due to mechanical stress, thermal shock, or packaging leakage, ensuring high reliability and stability.
    What is the operating temperature range of GBU2510?
    The GBU2510 can operate stably for a long time within a wide temperature range of -55℃ to +150℃. The glass melting point of the passivation layer can reach above 500℃.
    How does GBU2510 maintain low leakage current?
    The uniform and dense glass passivation layer effectively prevents ion migration, which minimizes leakage current and improves the consistency of the device's electrical performance.
    Is GBU2510 compliant with environmental standards?
    Yes, GBU2510 is compliant with the RoHS directive 2011/65/EU, and its molding compound meets UL 94 V-0 flammability ratings.
    What are the key mechanical specifications of GBU2510?
    It features tin-plated leads solderable per J-STD002 and JESD22-B102, marked polarity on the body, and weighs approximately 3.8g (or 3.5g for the short pin version).
    Where is the GBU2510 rectifier chip typically used?
    It is widely used in automotive electronics, industrial/switching power supplies, LED lighting, audio equipment, adapters, high-power chargers, household appliances (like induction cookers and dishwashers), displays, TVs, and printers.

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