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Standard Bridge Rectifier GBJ2510 - 25A, 1000V | China Suppliers & Factory for High-Quality Components
The glass passivation layer formed by the GPP process is tightly bonded to the chip, and it is less likely to fail due to mechanical stress, thermal shock, or packaging leakage, making it more stable.
The glass melting point can reach above 500℃, and the device can operate continuously within the temperature range of -55℃ to +150℃.
The glass layer effectively prevents ion migration, reduces leakage current, and improves the consistency of electrical performance.
The passivation layer is uniform and dense, without air gaps, and has good wetting with the substrate, which can increase the lifespan of the device by tens of times.
GBJ2510 is a versatile chip suitable for harsh environments: Widely used in automotive electronics, industrial power supplies, switching power supplies, LED lighting, audio power supplies, displays, televisions, printers, adapters, high-power chargers, induction cookers, dishwashers, audio equipment, and household appliances, which require high reliability. With its outstanding adaptability, it can be easily applied in industrial and consumer electronics fields.
- Glass passivated chip
- High surge current capability
- Low leakage current
- Compliant to RoHS directive 2011/65/EU
- Solder dip 275 °C max. 7 s
- Molding compound meets UL 94 V-0 flammability rating, RoHS-compliant
- Terminals: Tin plated leads, solderable per J-STD002 and JESD22-B102
- Polarity: As marked on body
- Weight: Approximate 7.1g/6.8g(short pin)
What makes GBJ2510 and GBJ3510 highly reliable?
These bridge rectifiers feature an enhanced GPP (Glass Passivated Process) where the glass passivation layer is tightly bonded to the chip. This structure prevents failures caused by mechanical stress, thermal shock, or packaging leakage.
What is the operating temperature range of these devices?
With a glass melting point exceeding 500°C, the GBJ2510 and GBJ3510 can operate continuously and stably within a wide temperature range of -55°C to +150°C.
How does the GPP process improve device lifespan?
The GPP process creates a uniform, dense passivation layer without air gaps that wets well with the substrate. This stable structure can increase the device's operational lifespan by tens of times compared to non-passivated alternatives.
In what applications can the GBJ2510 be used?
It is highly versatile and suitable for automotive electronics, industrial power supplies, switching power supplies, LED lighting, home appliances (like induction cookers and dishwashers), adapters, audio equipment, and high-power chargers.
What are the mechanical and compliance standards of these rectifiers?
They feature molding compounds that meet UL 94 V-0 flammability ratings, are fully RoHS-compliant, support solder dip up to 275 °C for a maximum of 7 seconds, and have tin-plated leads solderable per J-STD002 and JESD22-B102 standards.