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Detailed explanation of high-efficiency MOSFET top heat dissipation package
Most MOSFETs used in power applications are surface mount devices (SMD), including packages such as SO8FL, u8FL, and LFPAK. The reason why these SMDs are usually chosen is that they have good power capability and smaller size, which helps to achieve more compact solutions. Although these devices have good power capabilities, sometimes the heat dissipation effect is not ideal.
Explain the topology of switch mode power supply in one article
Circuit topology refers to the connection between power devices and electromagnetic components in a circuit, while the design of magnetic components, closed-loop compensation circuits, and all other circuit components depends on the topology. The most basic topologies are Buck, Boost, and Buck/Boost, single ended flyback (isolated flyback), forward, push-pull, half bridge, and full bridge converters.
SiC SBD in SiC Power Devices
SiC can be used to obtain high-voltage diodes above 600V in the SBD (Schottky barrier diode) structure of high-frequency devices (the highest voltage withstand of Si's SBD is around 200V).