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China GBJ2510 Standard Bridge Rectifier 25A 1000V - Reliable Suppliers and Factory Solutions
GBJ2510 and GBJ3510 are the best choices for you when conducting efficient full-bridge rectification! They feature enhanced GPP process performance.
High Reliability
The glass passivation layer formed by the GPP process is tightly bonded to the chip, and it is less likely to fail due to mechanical stress, thermal shock, or packaging leakage, making it more stable.
High-Temp Performance
Excellent high-temperature performance: The glass melting point can reach above 500℃, and the device can operate continuously within the temperature range of -55℃ to +150℃.
Low Leakage & Insulation
Low leakage current and excellent insulation: The glass layer effectively prevents ion migration, reduces leakage current, and improves the consistency of electrical performance.
Stable & Long Lifespan
Stable structure and long lifespan: The passivation layer is uniform and dense, without air gaps, and has good wetting with the substrate, which can increase the lifespan of the device by tens of times.
Applications & Versatility
GBJ2510 is a versatile chip suitable for harsh environments. Widely used in systems requiring high reliability:
With its outstanding adaptability, it can be easily applied in industrial and consumer electronics fields.
Features
- Glass passivated chip
- High surge current capability
- Low leakage current
- Compliant to RoHS directive 2011/65/EU
- Solder dip 275 °C max. 7 s
Mechanical Data
- Molding compound meets UL 94 V-0 flammability rating, RoHS-compliant
- Terminals: Tin plated leads, solderable per J-STD002 and JESD22-B102
- Polarity: As marked on body
- Weight: Approximate 7.1g/6.8g (short pin)
Frequently Asked Questions
A: They feature enhanced GPP process performance which provides high reliability, excellent high-temperature operation, low leakage current, and a highly stable structure that significantly extends device lifespan.
A: Thanks to a glass melting point above 500℃, these rectifiers can operate continuously and reliably within a temperature range of -55℃ to +150℃.
A: The GPP process forms a glass passivation layer that tightly bonds to the chip. This structure resists failure from thermal shock, mechanical stress, and packaging leakage, ensuring high stability.
A: They are widely used in automotive electronics, industrial power supplies, switching power supplies, LED lighting, household appliances (like induction cookers and dishwashers), adapters, audio equipment, and other systems requiring robust full-bridge rectification.
A: Yes. They comply with the RoHS directive 2011/65/EU and feature a molding compound that meets the UL 94 V-0 flammability rating.
A: The terminals consist of tin-plated leads solderable per J-STD002 and JESD22-B102 standards, withstanding a maximum solder dip temperature of 275 °C for up to 7 seconds.